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HP Engineering entails utilizing established engineering disciplines to test and safeguard the manufacturing standards for new and existing HP products. Working with internal stakeholders and outsourced development partners, you will develop and execute solutions to resolve any existing issues, ensuring that our operating processes are cost-effective and uphold the highest quality.

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What makes a successful Engineer at HP? Check out the top traits we’re looking for and see if you have the right mix.

  • Communicator9
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  • Entrepreneurial6
  • Open-minded9
  • Problem-solver7
  • Team Player10


  • Medical

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  • Onsite Gym/
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A team of engineering employees in front of a whiteboard A woman engineer in a laboratory
  • “Our passion is to innovate in addressing daily engineering challenges.”

  • “At HP, innovative people collaborate together to create experiences and products that make the world a better place.”

  • “I joined HP not long ago, right after my undergrad studies; the amount of autonomy that my manager has given me was beyond my expectation. My seniors value my opinion and they trust me as a part of the team.”

  • “I love working at HP because it allows me to give back to the community and participate in volunteering events that I care about.”


Job ID 3038096 Primary Location Palo Alto, California, United States of America Date posted 12/19/2018

At HP, talent is our criteria. Join us in reinventing the standard for diversity and inclusion. Bring your awesomeness, and just be you!

HP Labs- 3D Printed Electronics Research Engineer – Palo Alto, CA

HP Labs is an international research organization with its headquarters and largest facility located in Palo Alto, CA. As HP's central research organization, HP Labs' purpose is to deliver breakthrough technologies and technology advancements that provide a competitive advantage for HP by investing in fundamental science and technology in areas of interest to HP.

The Advance Materials and Printing for 3D Lab at HP Labs is seeking a qualified candidate for an electronics research engineer focused on 3D printed electronics (3D PE). Primary research topic involves developing, testing and optimizing designs and printing parameters for 3D PE devices, balancing the process design rules with desired device outcomes using both printed and placed electronic components.

Please visit HP’s Multi Jet Fusion 3D printing technology websites for more information:


  • Participate in researching and developing HP’s novel 3D printed electronics technology
  • Use expertise in engineering discipline to design novel electronic devices showcasing the capabilities of the 3D printed electronics technology
  • Optimize printing parameters for printed electronic devices and adapt sensing systems into the 3D printer for developing controls systems for performance optimizations.
  • Develop and apply analytical methods for the design and characterization of 3D printed electronic devices
  • Contribute as a team member with other research scientists and engineers both on- and off-site to carry out the investigation, design, development, and execution of scientific research projects to generate new products, technologies, and intellectual property.
  • Work in a highly independent manner to create research plans, investigative procedures, and effectively execute research for both assigned and self-motivated investigations.
  • Develop and carry out protocols and processes for collecting, recording, and analyzing data; communicate results and conclusions to immediate team members as well as to an extended team of internal and external collaborators for review and feedback.

Education and Experience

  • Masters or PhD degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, Mechatronics Engineering, Physics or related scientific discipline
  • Minimum 4-6 years experience, including graduate or postgraduate research and/or industry experience

Knowledge and Skills


  • Thorough knowledge and training in electrical engineering, with emphasis in electronics, communication systems, control systems, and/or compute architectures
  • Expert in printed electronic device and/or PCA design, layout and validation
  • Significant experience in ECAD and MCAD design. Ideally, also experience with 3D printing file formats
  • Experience in electronic properties of materials and knowledge on materials trade-offs when designing electronic systems
  • Strong analytical skills as applied towards solving complex engineering challenges


  • Experience with 2D and/or 3D printed electronics approaches, materials and device design
  • Experience with RF devices, antenna design, RFID, NFC and/or Bluetooth communications
  • Experience with low power design, integrated sensor systems, FPGA and/or ASIC systems
  • PCA design experience balancing multiple requirements like size, cost, reliability, efficiency and performance
  • Experience with automated Pick and Place PCA assembly systems
  • Understanding of traditional and printed electronic component designs and materials with a grasp of factors affecting performance
  • Experience with 3D printing methods, including polymer 3D printing
  • Programming experience: Matlab, Python or other
  • System in package design experience: methods, materials, and device performance trade-offs
  • Basic understanding of material physical properties past electronic properties, like thermal and mechanical properties
  • Basic nanomaterial inks understanding

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